1. Define     Protection the LED Chip from external Environment(Humidity, Shock etc.)       ( Especially High Power : < 0.5Watt)     Transparent the LED light     Composition : Silicone Resin and some Additives (2part Silicone)

2. Encapsulation Process :     Potting Process     Silicone is potted to the LED     → Cured (150℃ * 1~2Hrs)

3. Application : High Power LED ( LCD Back Light Unit LED, IlluminationLED)

4. Features     Good Moldability (No Void, Good Adhesion, No Tacky etc.)     Good Reliability ( High Transparency, Good Thermal Stability, PCT, T/C, MRT etc.)