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1. Define
    Protection the LED Chip from external Environment(Humidity, Shock etc.)
      ( Especially High Power : < 0.5Watt)
    Transparent the LED light
    Composition : Silicone Resin and some Additives (2part Silicone)
2. Encapsulation Process :
    Potting Process
    Silicone is potted to the LED
    ¡æ Cured (150¡É * 1~2Hrs)
3. Application : High Power LED ( LCD Back Light Unit LED, IlluminationLED)

4. Features
    Good Moldability (No Void, Good Adhesion, No Tacky etc.)
    Good Reliability ( High Transparency, Good Thermal Stability, PCT, T/C, MRT etc.)

(54587) ÀüºÏ ÀÍ»ê½Ã ¼®¾Ï·Î 99(ÆÈºÀµ¿ 841)
Tel) 063-833-2020 / Fax) 063-833-2199

(06719) ¼­¿ï½Ã ¼­Ãʱ¸ ³²ºÎ¼øÈ¯·Î 2415(¼­Ãʵ¿ 1449-2) ÇÏÀÓºôµù 3Ãþ
Tel) 02-3470-2881~2 / Fax) 02-3470-2889

(28125) ÃæºÏ û¿ø±º ¿ÀâÀ¾ °úÇлê¾÷3·Î 176(°¢¸® 644-4)
Tel) 043-240-0900 / Fax) 043-217-5400

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